This is the fifth in a series of six articles on best-practice EMC and signal integrity techniques in electrical/electronic/mechanical hardware design. The series is intended for designers of electronic products, from building-block units such as power supplies, single-board computers, and ‘industrial components’ such as PLCs and motor drives, through to stand-alone or networked products such as computers, audio/video/TV, appliances, instrumentation and control, etc.
The techniques covered in these six articles are:
1) Circuit design (digital, analogue, switch-mode, communications), and choosing components
2) Cables and connectors
3) Filters and transient suppressors
4) Shielding
5) PCB layout (including transmission lines)
6) ESD, electromechanical devices, and power factor correction
A textbook could be written about any one of the above topics (and many have), and this magazine article format merely introduces the various issues and points to the most important best-practice techniques. Signal integrity is treated as ‘internal EMC’. Employing these well-proven techniques from the start of a new design generally reduces the number of iterations of hardware and software during development, and often reduces unit manufacturing costs too. EMC compliance is generally quicker, easier, with less risk of serious delays in time-to-market.
5. PCB layout
These PCB-level design techniques are well proven to reduce the cost and effort of meeting “external” EMC requirements such as FCC, VCCI, and/or the EMC Directive. They also improve “internal EMC”, part of which is signal integrity, and help reduce the number of design iterations it takes to get a product to market. As electronic technology advances (clock speeds increase, A/D converter resolutions improve) internal EMC problems multiply, and the well-proven techniques described here become more important for commercial success.
The PCB techniques described here interact with each other to give improvements which are much greater than each can achieve on its own. They mostly improve the PCB's RF coupling mechanisms, and apply equally well to all types of analogue and digital circuits and to all the high-frequency emissions and immunity phenomena involved with both “internal” and “external” EMC.
Understanding ‘why’ these methods work helps extract their maximum benefits, but all we have room for here is a brief tour of these techniques – a few excellent references are provided at the end.
5.1 Circuit segregation
For cost-efficiency, this needs to be employed from the start of the real design process. The layout of the PCB should not begin until it is known where any shielding and filtering techniques need to be physically applied, so an overview of mechanical assembly and component placement should be done early in the product development lifecycle.
The following areas are first identified:
Outside-world: Total control of the electromagnetic (EM) environment is not practicable.
Inside-world: Where total control of the EM environment will be achieved.
5.1.1 The boundary between outside- and inside-worlds
This can be a hard boundary to draw. Conductors which run outside of a product's enclosure are clearly subject to the full outside-world EM environment, but cables which remain internal to a product may also suffer a subset of those phenomena if the product
enclosure is not adequately shielded or external cables are not adequately filtered and/or suppressed. For example, a ribbon cable or jumper strip connecting two PCBs will not be protected from the outside-world’s high-frequency radiated RF environment unless there is to be an overall enclosure that provides adequate shielding over the whole frequency range of concern for both emissions and immunity.
The use of a single PCB for all the circuitry in a product is usually the most cost-effective way to meet EMC requirements. This is because it is easier to control the EM environment of a single PCB, with its obvious boundary between inside- and outside-worlds, than it is to control that of several PCBs and internal wires and cables. Many types of electronic products can avoid the need for a shielded enclosure if made using a single PCB (with no internal wires and cables) and the techniques described here. This can save costs in both materials and assembly, and allows a great deal more aesthetic freedom with plastic enclosure design.
5.1.2 Boundaries within an inside-world
When the inside-world circuitry has been determined, it should be further subdivided into dirty, high-speed, noisy, (etc.) potentially “aggressive” circuits, and clean, sensitive, quiet, (etc.) potential “victim” circuits. The likelihood of a circuit node being aggressive depends on its maximum dV/dt and/or dI/dt. The likelihood of a circuit node being a victim of EM phenomena depends on its signal levels and noise margins (less = greater sensitivity).
5.1.3 Segregation
The various inside-world areas should be physically segregated from each other, and from the outside-world, both mechanically and electrically. Start at the earliest design phase by showing the segregated areas clearly on all drawings, usually done by drawing dotted lines around rectangular areas each covering one segregated portion of the circuit.
Ensure that this segregation is maintained throughout the rest of the design process including system design, PCB layout, wiring harness design, mechanical packaging, etc. Showing segregation clearly on all system, wiring, and circuit diagrams is of great help in communications between electronic designers, mechanical designers, and PCB layout persons – and is especially important where work is done by people on different sites, or by subcontractors.
Most design occurs in two dimensions. It is not uncommon to find that, in the final assembly, a PCB carrying a very sensitive circuit (such as a thermocouple or microphone amplifier) finds itself in close proximity to a noisy circuit (such as a switch-mode power converter), with consequent signal quality problems. Such unpleasant and time-consuming three-dimensional assembly problems should be avoided by detailed visualisation of the final assembly from the start, even before the circuits are designed and the PCBs laid out.
Figure 5A shows good segregation practices applied to a single-pcb product, whether it has an overall enclosure shield or not.
This example shows that the segregated area where the outside world interface suppression components are fitted, is along one edge of the PCB, as if it were a wall between outside and inside-worlds (which it is, in a way).
This area would only contain opto-isolators, isolating transformers, baluns, filters, transient absorbers, similar interfacing components but no ICs. It would also contain bonding points for the screens of any screened cables, and/or for any enclosure shielding. If this example PCB was part of a larger assembly, the segregation techniques employed for best EMC would be just the same.
The inside/outside-world interface components are restricted to one dedicated edge of the PCB to encourage all unwanted external currents (e.g. caused by voltage differences in protective earths) to restrict themselves to that area of the PCB, and discourage them from flowing through circuit areas.
Where an effective enclosure shield exists, the inside/outside-world boundary becomes the shielded wall of the enclosure. All of the associated filtering and suppression components, and cable screen bonding, must then use a connector panel set in the wall of the enclosure as their reference (as described in Part 4). A single area for all interconnections is still best. A wider range of PCB-mounted screened and/or filtered connectors that can also bond to a metal panel is now available. These parts would be soldered to the PCB reference plane, then electrically bonded metal-to-metal to the wall of a screened enclosure during final assembly, and can be very cost-effective.
Narrow channels free from components should be left between each of the segregated circuit areas on the PCB. These should be wide enough for the fitting of a PCB-mounted “tuner-can” shield, and provision should be made (at least on prototype boards) for bonding such screening cans to the 0V plane at frequent intervals (say, every 15mm) along all edges.
