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Signal Integrity and Its Effect on EMI and High Speed PCB Design |
A comprehensive three-day course from high-speed design’s “ratchet man,” covering all key aspects of the high-speed design process
Practical and comprehensive
This highly practical course is designed to take the student through the entire process involved in designing and fabricating high-speed PCBs. It begins with the fundamentals of electromagnetic fields and the behavior of transmission lines that are the basis for all high-speed signaling. From there it examines all aspects of high-speed design leading to the development of a robust set of PCB design rules that accounts for power subsystem design, routing rules and design of PCB stack-ups, and fabrication rules needed to balance performance against cost and manufacturability.
The materials and examples used in this course are drawn from actual designs of high-speed systems in current manufacture. These examples range from video games to terabit routers and cover the complete range of designs. The design process presented is based on many years of completing designs that are “right the first time.” Students are shown many ways to improve their design process so that designs meet this objective. Reliable methods for controlling and containing EMI are also covered.
This course is based on the popular two-day course that has been attended by more than 5,000 engineering professionals. The third day has been added at the request of many of those students who asked for a detailed session on how to use the various simulators that are an integral part of developing robust high-speed design rules. The third day is spent examining the various types of simulators as well as how to use them in the design process. Many actual design problems are solved using the simulators in class. Students are encouraged to bring actual design problems to the simulation session.
Who Should Take This Course
This course is designed for all participants in the design and fabrication process. Among those who should find it valuable are
- Design engineers
- System architects
- EMC specialists
- Signal integrity engineers
- Technicians
- PCB layout professionals
- Applications engineers
- IC designers
- IC package designers
- Test engineers
- Project engineers
- Design managers
- Engineering managers
Why Take This Course?
Electronic designs of all kinds are operating at ever faster clock rates and faster rise times. At the same time, the pressure to complete designs in fewer and fewer design cycles is putting pressure on design teams to deliver designs to manufacturing that are “right the first time.” In order to account for the normal variations in component edge rates, propagation delay variations, amplifier gains, logic levels, and variations in the PCB fabrication process, it is necessary to invoke the use of design tools and methods that allow “preroute” analysis to insure the final product is designed correctly. With the speeds of signals and components rising into the gigahertz range, relying on the traditional bread boarding or hardware prototyping process often results in a product never making it to market. This increase in component speed has made it necessary for all design engineers to master the design techniques that were once only the province of super computer engineers. This course relies heavily on the proven methods developed for supercomputers and addresses the most common high-speed problems, including
- Failures from crosstalk
- Problems related to time delays in PCB traces
- EMI failures
- Failures stemming from poor power system design
- Failures related to poor IC package design
Note: Any engineering professional who works with high-speed design will understand the materials presented. No advanced mathematics are required. |
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